Therefore, for P-CAD 98 you need: click File->Reports. In P-CAD 98, this file is generated similarly, but there is no information about the type and value of the component, but it is present in. Select the file name buttons Filename (for example, "info" - the expansion of P-CAD to supply yourself), and click Generate. Add to the Selection tab of all the fields in the following order: RefDes, Layer, LocationX, LocationY, Rotation, Fixed, Type, Value. Select the list of Component Locations (cpl), click Customize, Format tab, verify that the panel Separated List are two checkboxes. Select Panel Style Format: Separated List. In P-CAD 2004/2006 this file is generated as follows: File-> Reports. For the P-CAD 2004/2006 will be one such file, for P-CAD 98 such files will be two: one half of the data, half in another. Similarly, to get the file bott.dxf with the bottom layer silk.ģ,4. To this end, P-CAD 2006 to choose File-> Export-> DXF, (for P-CAD 98 just File-> DXF), then select the desired layers (eg, board to board borders and Top Silk with silk-screen printing), remove the tick Output Drill Symbols, specify a file name (for example, top.dxf), leave the unit inch (Inch). Want to save as separate files upper and lower layers of silk.
#HOW TO CREATE COMPONENT IN PCAD 2006 MANUAL#
Manual translated from automatic translator, sorry.įor the program will require four (or three) input file:ġ,2: the installation diagram in the blanks format dxf, obtained export silk layer in P-CAD layout of the original board. The program also generates a text list of components, where the marks, what type of components is associated with which character on the circuit board.
This simplifies the visual search component on the board. The basic principle: each type of component (identical components) are marked with a unique symbol that has its own color and style. For his work requires some files with information on the printed circuit board, package generated P-CAD. For the initial design the path resistance from the VRM to U1 was 18.3 mΩ, and for the improved design it dropped to 9.093 mΩ.The program is designed for automatic coloring schemes of printed circuit boards for ease of installation. In addition to the power loss, voltage drop and current vector results, the path resistance between sources and sinks was calculated. The original power dissipated due to joule heating within the PCB was ~1.2 Watts but, due to the simple design change, the power dissipated was reduced to ~0.6 Watts. Another significant advantage is the power dissipated on layer 1 was almost cut in half due to the addition of the copper flood in the improved design. This improved design shows a better current distribution resulting in less voltage drop at the farthest CPU (U1). copper flood on layer 1 along with an additional 10 via transitions from layer 1 to layer 5. The improved design shown in Figure 1 added a ½ oz. The improved design shows an improvement of 70 mV (~8% voltage drop to ~4% voltage drop) at the farthest CPU (U1). The voltage gradient goes from 1.8 VDC to ~ 1.65 VDC.
The bottom pictures show the voltage gradient on the Vcc plane. The cutout view in the upper right shows a comparison between the initial layout and the improved layout where a copper flood and multiple via transitions from layer 1 to layer 5 were added. In addition, layer 1 dissipates ~1.2 watts of power which must be reduced to meet the supplied specification.įigure 1: Upper left shows the location of the VRM and the two CPUs. This results in 8.3 amps through the single via, causing the farthest CPU (U1) to see a 150 mV (~8%) voltage drop. Vcc has only one via transition from layer 1 to layer 5. The initial layout brings power from the voltage regulator module (VRM) through an inductor to each of the CPUs.
Using the ANSYS® SIwave-DC simulation tool, we can predict DC power loss and voltage drop for a PCB and then use those results to improve the PCB layout prior to fabrication.įor example, in the design in Figure 1, the Vcc power rail supplies 1.8 VDC power to two CPUs (U1 and U2). It is often necessary to predict the DC performance of power rails to ensure that enough via transitions exist and adequate copper weighting (½ oz, 1 oz, 2oz, etc.) is present to minimize voltage drops during turn-on events and normal operation. Prediction of the PDN performance is critical to ensure consumer electronic products function as specified and meet battery life expectations.
#HOW TO CREATE COMPONENT IN PCAD 2006 HOW TO#
In this product-how to, ANSYS’ Steve Pytel explains how to use the ANSYS SIwave-DC simulation tool to predict DC power loss and voltage drop for a PCB.Īs supply voltages continue to decrease and transistor count follows Moore’s law, power delivery network (PDN) integrity has become an important consideration for any electronic package or PCB design.